Flip chip mounting
Implementation technology for directly mounting LSI bare chips.
Flip chip mounting is one method of mounting bare chips. Compared to wire bonding, it allows for a smaller mounting area and has better electrical characteristics due to shorter wiring. Even though it is called flip chip mounting, there are multiple mounting methods available, and we can propose a method based on your requirements. - It can accommodate a minimum pitch of 80 microns. - It is also possible to mix mount with SMT components.
- 企業：ピーダブルビー 草津事業所
- 価格：Other
